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Qualcomm chips at forefront of AI device deployment: CFO

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Qualcomm chips at forefront of AI device deployment: CFO






Qualcomm Unveils Latest Generation Chips and AI Models at 2024 World Mobile Congress

Qualcomm Unveils Latest Generation Chips and AI Models at 2024 World Mobile Congress

Semiconductor designer Qualcomm (QCOM) showcased its latest generation of chips and AI models for mobile devices at the 2024 World Mobile Congress in Barcelona, Spain. Qualcomm CFO and COO Akash Palkhiwala sits down with Yahoo Finance’s Brad Smith to discuss the company’s artificial intelligence hub and use cases across devices:

“You’re already seeing the benefit of large language models on data centers. We’ve seen this show up in the financial performance of some of our peers. I think what’s going to happen next is these models are going to be deployed on edge, on devices at large scale, and this includes not just phones but PCs and automotive and IOT [Internet of Things] devices, and that’s a tremendous opportunity for Qualcomm, as these models get deployed in these devices. Our chips will be at the forefront, making these deployments very easy for developers, for consumers, and bringing some incredible new use cases for the consumers to enjoy.”

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Editor’s note: This article was written by Luke Carberry Mogan.


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